Researchers from the A*STAR’s Singapore Institute of Manufacturing Technology (SIMTech) developed a new manufacturing system of next generation Light Emitting Diodes (LEDs) which could dramatically improve the way small electronic devices keep cool. Named liquid forging, the new technique has taken the first leap from research laboratory towards the global market in high-powered lighting. Many… »

IBM partnered with 3M in order to develop adhesives that can be used to package semiconductors into 3D semiconductors. In order to develop these densely stacked silicon “towers”, IBM will draw on their expertise in creating unique semiconductor packaging processes, and 3M will provide their expertise in developing and manufacturing adhesive materials. The joint research… »